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3V/5V Compatible) Package Type DIP (24 * 43 mm) Weight 11 ± 0
Note: SDC2 is not led to the stamp hole and is used to connect eMMC or FLASH memory chips on the board
What crash protection design does this temperature module integrate for harsh industrial sites
low-power heterogeneous system-on-module (SoM) based on the industrial-grade Allwinner T113-i processor (dual-core Arm Cortex-A7 @ 1
Ebyte NB144 Series Industrial Grade Ethernet 4-channel Serial Server RS485/RS232/RS422 Edge Computing Gateway ModBus Gateway WoR 3V/5V Compatible) Package Type DIP
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