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it is the preferred bonding solution for precision assembly fields
ASSEMBTEK – Your Adhesive Process Engineering Partner
👉 [Button: Consult Application Engineer] Our laboratory can provide free substrate priming testing
Rapid curing at room temperature
Loctite 3517M Epoxy Underfill Adhesive it is the preferred bondingLOCTITE 3517M, epoxy, underfill LOCTITE 3517M is an underfill material specially developed to protect and strengthen solder joints in handheld devices. One component no mixing required Can be reworked Low halogen content
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